Blueprint studio · Spec sheets · Amber callouts · Free shipping over $75
Sheet A · Product board
Unit price
USD25.89
USD68.89

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Field rating
4.9

Verified studio score · Spec revision current

Fit · Size

XZZ L23 CPU Reballing Stencil Platform For iPhone A8-A16 BGA Repair Digital Multimeter MJPEG /YUYV

SKU: 18815273402

Dispatch

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Aug 31 - Sep 5

Description

MJPEG /YUYV

large screen intuitive

The dot matrix module saves the original coordinates to the coordinate instrument before repairing

Diopter adjustment: +/-5DP

XZZ L23 CPU Reballing Stencil Platform For iPhone A8-A16 BGA Repair Digital Multimeter MJPEG /YUYVXZZ L23 CPU Universal BGA Reballing Stencil Platform for iPhone A8 A16 Qualcomm MTK Hisilicon CPU tin planting. XZZ L23 BGA Reballing Stencil Platform for iPhone 6 to 14 Pro Max A8 A9 A10 A12 A13 A14 A15 A16, Qualcomm, MTK, Hisilicon CPU IC soldering repair. Features: Magnetic power positioning with strong magnetic force and automatic alignment. Built in powerful magnets with strong adsorption for easy pick up and fast maintenance. Easy to operate

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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