MECHANIC Heat-Mini IC Glue Removal Station for Chips up to 18*21mm Clearance Items Original Goot Wick Soldering Wick

Original Goot Wick Soldering Wick Accessory Braided Copper Wire Desoldering Wick BGA Solder Remover CP1515 CP2015 CP2515 CP3515

8 inch U Disk Computer Storage Mouse Control Industrial Camera For Phone Tablet PCB Soldering Repair Live Streaming Teaching

"Multiple" port charging

can be connected to mobile phone and computer

MECHANIC Heat-Mini IC Glue Removal Station for Chips up to 18*21mm Clearance Items Original Goot Wick Soldering WickMECHANIC Heat Mini Heating Station for Mobile Phone CPU IC Glue Removal. Intelligent one click heating, adjustable from 160C to 250C. Easily removes adhesive glue with a brush without damaging the chip. The 18*21mm heating area is compatible with most mobile phone chips, Nand Flash, CPUs, and other tasks involving adhesive and solder removal. Features: 1. Employs a professional temperature control curve algorithm with a built in factory calibrated