Amaoe BGA Reballing Stencil For Huawei CPU RAM WIFI IC HW1-HW19 Brand:Amaoe C/C++/C#/VB6/VB

C/C++/C#/VB6/VB

a power jack

not affected by the air volume

The main intended purpose of Medusa PRO II Box is repairing dead boots of the devices (mobile phones

Amaoe BGA Reballing Stencil For Huawei CPU RAM WIFI IC HW1-HW19 Brand:Amaoe C/C++/C#/VB6/VBAmaoe 0. 12mm BGA reballing stencil HW1 HW2 HW3 HW4 HW5 HW6 HW7 HW8 HW9 HW10 HW11 HW12 HW13 HW14 HW15 HW16 HW17 HW18 HW19 for Huawei CPU RAM WIFI IC soldering repair. Amaoe BGA Reballing Stencil steel mesh for huawei Honor Mate Nova Enjoy Maimang series. Option: HW: 1: Kirin 930 935 HI3630 3635 CPU, for Huawei P8, Mate7 MTS, Honor 7 X2, ect. HW: 2: MSM8916 8939 MT6753V CPU, for Huawei G7 G8X 5S, Honor 7i Play 5X, ect. HW: 3: Kirin 950 955 HI3650 CPU,