Blueprint studio · Spec sheets · Amber callouts · Free shipping over $75
Sheet A · Product board
Unit price
USD45.99
USD73.99

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Field rating
4.9

Verified studio score · Spec revision current

Fit · Size

YCS M.Y CPU/Middle Layer Reballing Platform for iPhone X-17 Pro Max laser welding machine Tester: The Mechanic Sherlock V2

SKU: 71209036118

Dispatch

Shipping Estimate
USA
  • USA
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Ships within 48 hours · Estimated delivery Sep 16 - Sep 21

Description

Tester: The Mechanic Sherlock V2

Lens: HD microscope lens

supports iPhone 6/6S/7/8/X/11/12/13/14/15/16/17 series and Android phones

color correction and other functions

YCS M.Y CPU/Middle Layer Reballing Platform for iPhone X-17 Pro Max laser welding machine Tester: The Mechanic Sherlock V2YCS MR. YANG BGA Reballing Stencil with Platform Kit for iPhone X 17 Pro Max middle layer and A11 A19 Pro CPU soldering repair. The reballing soldering kit includes various stencils designed for replacing and resoldering different circuit boards. It safely and effectively resolders iPhone CPU or mid frame solder joints, helping to repair iPhone malfunctions caused by solder joint issues. The BGA reballing platform kit supports repairs of mid layer

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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